Título
Elastic modulus determination of Al-Cu film alloys prepared by thermal diffusion
Autor
RODRIGO HUERTA QUINTANILLA
ANDRES IVAN OLIVA ARIAS
FRANCIS AVILES CETINA
JESUS GONZALEZ HERNANDEZ
JOSÉ EMILIO CORONA HERNANDEZ
Nivel de Acceso
Acceso Abierto
Materias
Resumen o descripción
Elastic moduli of 50-250 nm thick Al-50 at Cu film alloys deposited by thermal evaporation on Kapton substrates and postformed by thermal diffusion are investigated. Formation of the Al 2Cualloy phase was confirmed by X-ray photoelectron spectroscopy (XPS). Surface morphology was examined by atomic force microscopy (AFM) and scanning electron microscopy (SEM) before and after tensile mechanical testing. Force-strain curves of the Al-Cu alloy were obtained by subtracting the effect of the force-strain Kapton curves from the corresponding curves of the Al-Cu/Kapton system. A reduction in the elastic modulus of the Al-Cu alloys from 106.1 to 77.8 GPa with the increase of alloy thickness was obtained. Measured elastic moduli were between the reported bulk modulus for Al and Cu. Reductions in the surface roughness and increments in the grain size were measured after tensile testing of the Al-Cu alloys.
Fecha de publicación
2012
Tipo de publicación
Artículo
Versión de la publicación
Versión publicada
Recurso de información
Formato
application/pdf
Fuente
Journal of Nanomaterials, 2012 doi:10.1155/2012/895131
Idioma
Inglés
Relación
&
Corona, J. E. (2012). Elastic modulus determination of al-cu film alloys prepared by thermal diffusion. Journal of Nanomaterials, 2012 doi:10.1155/2012/895131
Sugerencia de citación
Huerta, E., Oliva, A. I., Avilés, F., González-Hernández, J.,
Repositorio Orígen
Repositorio Institucional CICY
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