Título

Stress analysis in a classical double lap, adhesively bonded joint with a layerwise model

Autor

ALBERTO DIAZ DIAZ

Nivel de Acceso

Acceso Abierto

Referencia de datos

doi: https://doi.org/10.1016/j.ijadhadh.2008.01.004

Resumen o descripción

This paper focuses on stress analysis in classical double lap, adhesively bonded joints having constant layer thicknesses. Several analytical methods found in the literature do not provide adequate information on stresses at the adherend/adhesive interfaces. In these methods, the adhesive thickness is assumed to be small compared to that of the adherends and the stresses to be uniform through the adhesive thickness. Herein, the model proposed by the authors can be considered as a stacking of Reissner–Mindlin plates (six plates for a double lap joint). The equations based on stacked plates were applied to the geometry of a symmetrical, double-lap, adhesively bonded joint. Finally, the model has been validated by comparing the model results with those of a finite element calculation.

Fecha de publicación

2003

Tipo de publicación

Artículo

Formato

application/pdf

Idioma

Inglés

Relación

&

Ehrlacher, A. (2009). Stress analysis in a classical double lap, adhesively bonded joint with a layerwise model. International Journal of Adhesion and Adhesives, 29(1), 67-76.

Sugerencia de citación

Diaz, A. D., Hadj-Ahmed, R., Foret, G.,

Repositorio Orígen

Fuente de Objetos Científicos Open Access

Descargas

581

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