Título
Stress analysis in a classical double lap, adhesively bonded joint with a layerwise model
Autor
ALBERTO DIAZ DIAZ
Nivel de Acceso
Acceso Abierto
Referencia de datos
doi: https://doi.org/10.1016/j.ijadhadh.2008.01.004
Resumen o descripción
This paper focuses on stress analysis in classical double lap, adhesively bonded joints having constant layer thicknesses. Several analytical methods found in the literature do not provide adequate information on stresses at the adherend/adhesive interfaces. In these methods, the adhesive thickness is assumed to be small compared to that of the adherends and the stresses to be uniform through the adhesive thickness. Herein, the model proposed by the authors can be considered as a stacking of Reissner–Mindlin plates (six plates for a double lap joint). The equations based on stacked plates were applied to the geometry of a symmetrical, double-lap, adhesively bonded joint. Finally, the model has been validated by comparing the model results with those of a finite element calculation.
Fecha de publicación
2003
Tipo de publicación
Artículo
Recurso de información
Formato
application/pdf
Idioma
Inglés
Relación
&
Ehrlacher, A. (2009). Stress analysis in a classical double lap, adhesively bonded joint with a layerwise model. International Journal of Adhesion and Adhesives, 29(1), 67-76.
Sugerencia de citación
Diaz, A. D., Hadj-Ahmed, R., Foret, G.,
Repositorio Orígen
Fuente de Objetos Científicos Open Access
Descargas
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