Título
Effects of Silicon Nanoparticles on the Transient Liquid Phase Bonding of 304 Stainless Steel
Autor
HECTOR MANUEL HERNANDEZ GARCIA
RITA MUÑOZ ARROYO
JORGE LEOBARDO ACEVEDO DAVILA
FELIPE DE JESUS GARCIA VAZQUEZ
FELIPE ARTURO REYES VALDES
Nivel de Acceso
Acceso Abierto
Materias
Resumen o descripción
Transient liquid phase (TLP) bonding of 304 stainless steel with nickel based filler metal, BNi-9, was performed to
study the influence of silicon nanoparticles (NPs) on the mechanical and structural properties of the bonding area.
It was found that silicon NPs act as a melting point depressant in the brazing process; the formation of silicon TLP
induces the dissolution of elements of the metal filler and promotes a uniform distribution in the bonding area.
Silicon NPs induce the development of smaller eutectic structures in the melting zone; it has been related to
microhardness measurements, which are lower when the silicon NPs are used in the brazing process.
Fecha de publicación
2014
Tipo de publicación
Artículo
Versión de la publicación
Versión publicada
Recurso de información
Formato
application/pdf
Idioma
Inglés
Sugerencia de citación
H.M. Hdz-García, A.I. Martinez, R. Muñoz-Arroyo, J.L. Acevedo-Dávila, F. García-Vázquez, F.A. Reyes-Valdes. (2014) Effects of Silicon Nanoparticles on the Transient Liquid Phase Bonding of 304Stainless Steel. Elsevier. J. Mater. Sci. Technol., 2014, 30(3), 259e262.
Repositorio Orígen
COMIMSA
Descargas
444